Scaling in a Dynamic World: Why the Future of Semiconductors Depends on Photonic Integration

The global semiconductor industry is entering a defining era. With projections suggesting the market will surpass $1 trillion by 2030, much of this explosive growth is being fuelled by the relentless rise of artificial intelligence (AI). However, the demand for raw computing power is only part of the story. Equally critical is the need for fast, intelligent, energy-efficient sensing at the edge – all needed to power and train increasingly complex AI models. 

As this demand skyrockets, the limitations of traditional CMOS-based hardware are becoming clear. While system complexity is increasing, data traffic is surging, and energy costs are climbing. It’s time to go beyond scaling transistors and to scale smarter. 

More than Moore: The Shift Toward Hybrid Hardware Platforms 

To sustain this growth, the industry is embracing “More than Moore” strategies: co-packaged optics, novel materials, and new computing paradigms. At the forefront of this shift are Photonic Integrated Circuits (PICs) – a technology set to transform the semiconductor landscape. 

PICs offer high bandwidth, ultra-low latency, and exceptional energy efficiency, essential attributes for data transmission, edge processing, and real-time sensing. Their miniaturisation capabilities are enabling breakthroughs in areas such as: 

• High-speed interconnects in data centres and AI clusters 

• Next-gen biosensing for diagnostics and health monitoring 

• LIDAR and 3D sensing in mobility and robotics 

• Quantum photonics for future computing and communication 

Meanwhile, the backdrop is anything but stable. Geopolitical shifts and volatile demand patterns mean that adaptability is just as crucial as innovation. 

So, how do we navigate this transition – from potential to impact? 

Join the Conversation at PIC Summit Europe 2025 

At PIC Summit Europe 2025, taking place on 4 and 5 November 2025 in Eindhoven, the Netherlands an entire ecosystem of designers, foundries, integrators, OEMs, investors, and thought leaders come together to explore exactly these questions. 

Through two days of high-impact keynotes, panel discussions and networking, you’ll gain first-hand insights into how the world’s most innovative companies are scaling in a dynamic world: 

• How will AI workloads be supported by energy-efficient Integrated Photonics interconnects? 

• What does the successful integration of PICs and CMOS look like in practice? 

• Which standards, platforms, and partnerships are shaping the next phase of hardware innovation? 

Whether you’re a chip architect, systems integrator, design house, startup, or policymaker, this event offers a front-row seat to the future of semiconductor technology. 

Be part of the conversation. Be part of the solution. 

Register now for PIC Summit Europe 2025 and connect with the experts shaping the next trillion-dollar wave.