Packaging & assembly (Panel level integration)

Scope

The project aims to develop scalable, and therefore cost-efficient, assembly packaging technology for integrated photonic chips. This packaging technology comprises a high-density electrical interconnect and pluggable optical interconnect, efficient and scalable manufacturing processes as well as improved thermal management.

Main result achieved

CITC has developed an ultra-low loss optical interconnect, which is under patent application. The adiabatic surface coupling features automated passive alignment with relaxed alignment tolerances and high coupling efficiency.