Flip-Chip bonding of InP components

Scope

The projects aim to develop reference chips for micro-transfer printing technology supporting scalable integration and improved heat sinking and coupling efficiency and to integrate P laser/amplifiers onto imec’s 200mm SiPho platform.

Main result achieved

imec VZW has begun to set up its pilot line for micro- transfer printing on 200mm wafers with an extension planned for 2025 and a demonstration for integration on 100mm wafers has been performed. Collaboration with SMART Photonics has led to a supply chain for micro- transfer-printing InP components being set up. Excellent progress has been made in the wafer-scale flip-chip assembly of InP components on imec’s iSiPP platform, with x-y alignment precision now repeatably better than 500nm, a first full featured iSiPP200N tape-out being completed and knowledge transfer with PHIX for high-precision flip-chip bonding being established.