Heterogeneous integration and advanced packaging is essential for connecting chips and protecting them. The Chip Integration Technology Centre (CITC), located in Nijmegen, bridges the gap between science and industry in the field of materials, machines and semiconductors. In the centre, new technology is being developed to make the packaging of the chip smaller, better and cheaper. Chip manufacturers, test and packaging companies, material suppliers, software developers, photonics firms and research institutions will work together on creating this innovative chip integration technology.
With the team in place, the design of offices & lab rooms and program lines running, the CITC was able to officially open on the 5th of March.