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Opportunities in
Datacom and Telecom

Driven by the growing use of smartphones, Internet of Things, Smart cities and autonomous driving, there is a strong need for next generation telecom systems and equipment characterized by increased flexibility, more and faster processing capacity and bandwidth density and at the same time a reduction in cost, power consumption and size. This is where integrated photonic chips play an important role; optical chips can send and receive multiple light signals simultaneously, all within the same physical size.

Example of key opportunities we see are:

Optical transceivers and components for high-throughput, secure (long-haul) free-space communications links;

Optical-domain RF beamforming and optical phased arrays modules for satellite, mobile and wireless communications;

Optical transceivers for ultra-high data transfer for short- haul/metro telecom fiber-based access networks/datacenters.

Examples Datacom and Telecom 

The highly integrated optical communications products are based on Dense Wavelength Division Multiplexing (DWDM) with Broadband Ultra-narrow linewidth Tunable Laser. These products can handle huge bandwidths of data in a far more condensed, energy efficient and cost-effective way than current optical devices.  The key enabling technology for DWDM systems is full monolithic integration of all photonic components within a single chip. Our partners are able to produce these in volume with high yield at low cost. 

5G networks
The 5G network is the future telecom network, where the connection density reaches 1 per m2 and applications require front haul round trip times less than 1ms. Integrated Photonics and PICs play an important role in building capacity for 5G and other parts of the network to support the data traffic. Bringing radio signals into the optical domain via beamforming technologies, processing them and transforming them back into radio frequencies, no longer requires time-consuming, and power consuming high-speed electronics. The processing could be sped up by a factor of 1,000 to 1 million when performed with an integrated optical-wireless fabric.


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