Innovation mission Taiwan: integrated photonics and semiconductor advanced packaging

04.09 - 08.09.2023

As the largest semiconductor producing country in the world, Taiwan is indispensable in the development of integrated photonics and advanced semiconductor packaging. This is why a Dutch innovation mission will visit Taiwan to explore the opportunities and developments of these technologies.

Integrated photonics and advanced packaging are important technologies with a wide range of applications in both The Netherlands and Taiwan. Taiwan has an extensive semiconductor ecosystem with major companies such as TSMC, Mediatek, UMC, ASE, SPIL and many more.

The innovation mission is organised by the Netherlands Enterprise Agency and the Netherlands Office Taipei.

For whom?

This innovation mission is intended for professionals from Dutch governments, industries and knowledge institutions who work on integrated photonics and/or advanced packaging of semiconductors.

Mission goals

With this mission we want to achieve a number of things.

  • Exploring and finding potential partners for joint research, development and commercialization of technological innovations within the production of photonic chips with focus on advanced packaging, heterogeneous integration and chiplet technology, compound semiconductor materials and applications such as LIDAR, medical sensing and health monitoring.
  • Strengthening bilateral cooperation between government, industry and knowledge institutions.
  • Developing bilateral arrangements and programs to support bilateral cooperation.

Concept programme

  • Monday 4 September: visit to Taiwanese gouvernment, companies and/or knowledge institutions.
  • Tuesday 5 September: company visits outside Taipei (Hsinchu/Kaohsiung).
  • Wednesday 6 September: participation in the SEMICON Taiwan trade fair and seminar on technological cooperation by way of a Dutch-Taiwanese Innovation Cooperation Conference.
  • Thursday 7 September: participation in the SEMICON Taiwan fair and matchmaking
  • Friday 8 September: free time for own meetings or trade fair visits and cultural activities.

Registration for this innovation mission is closed.